Highly integrated, Time-of-Flight, 3D vision chipset

June 16, 2017 // By Graham Prophet
Melexis (Tessenderlo, Belgium) has announced a Time-of-Flight (ToF) chipset and development kit intended to enable simple, modular and future proof design of 3D vision systems for automotive, industrial and smart city applications. Previously available only as part of a development system, the chipset is now available stand-alone.

The chipset includes the MLX75023 1/3-inch optical format ToF sensor and the MLX75123 companion IC that embeds many of the external components normally required to develop a 3D vision solution. With this high level of integration, designers no longer have to be concerned with expensive (and space-hungry) external FPGAs and ADCs thereby reducing size, design cost, product cost and time-to-market.

The MLX75023 ToF sensor offers the smallest-available pixel at QVGA resolution with 63 dB linear dynamic range and sunlight robustness, using Melexis' own pixel technology. The MLX75123 companion chip directly interfaces the sensor IC to a host MCU and provides rapid readout of data from the sensor.

The modular approach taken in designing the chipset means that the sensor can be changed / upgraded without having to change the product architecture. This allows the design of multiple solutions with the same base design as well as rapid implementation of new sensors as they reach the market.

 

Typical applications for the chipset include gesture recognition, driver monitoring and occupant detection in automotive applications. The chipset is suitable for other applications including industrial (conveyer belts, robotics, volume measurement) and smart cities (people counting, security, etc.). The chipset is available in both automotive (-40°C to +105°C) and industrial (-20°C to +85°C) grades.

 

Melexis; www.melexis.com