Imaging SOCs expand vision options with smaller automotive cameras

October 12, 2017 // By Graham Prophet
ON Semiconductor has added two highly integrated 1.0 Megapixel (Mp) CMOS image sensing products. The new parts provide a complete solution with the image sensor and processing functionality integrated within a low power system-on-chip (SoC) that simplifies and speeds adoption in applications such as rear and surround view cameras.

PCB real estate savings of greater than 30% can be achieved compared to conventional solutions comprised of discrete sensor and processor components. This helps designers to implement camera solutions without impacting vehicle styling or aesthetics; smaller camera systems allow more cameras to be used.

 

The AS0140 and AS0142 are both 1/4-inch format devices capable of supporting 45 fps throughput at full resolution or 60 fps at 720p. Key features include distortion correction, multi-colour overlays and both analogue (NTSC) and digital (Ethernet) interfaces. Both SoC devices achieve enhanced image quality by making use of the adaptive local tone mapping (ALTM) in order to eliminate artefacts that impinge on the acquisition process. Dynamic range of 93 dB allows the devices to operate effectively in both high and low light applications. The AS0140 and AS0142 provide multi-camera synchronisation support which increases their value to automotive design engineers as the number of cameras installed on vehicles continues to rise.

 

When running at 30 fps in high dynamic range (HDR) mode, they consume 530 mW. Operating temperature range is -40°C to +105°C, for use in automotive environments. Engineering samples are available now. The AS0140 will be in production in 4Q17, and AS0142 will be in production in 1Q18.

 

ON Semiconductor; www.onsemi.com